Incompressible Pore Effect on the Mechanical Behavior of Low-K Dielectric Films https://doi.org/10.1557/proc-750-y9.9
Plasticity Effects on Interfacial Fracture of Thin Gold Films
Mechanical Reliability and Characterization of Modern Microelectronic Interconnect Structures
Characterization Techniques for Evaluating Strained Si CMOS Materials https://doi.org/10.1063/1.1622475
Optical and Dielectric Properties of Eu- and Y-Polytantalate Thin Films https://doi.org/10.1557/proc-786-e3.31
Oxide Reduction in Advanced Metal Stacks for Microelectronic Applications https://doi.org/10.1557/proc-786-e6.33
Application of FIB/SEM and TEM to Single Bit Failure Analysis in SRAM arrays https://doi.org/10.1557/proc-782-a5.77
Fracture Patterns in Thin Films and Multilayers https://doi.org/10.1557/proc-795-u3.8
Irradiated Cubic Single Crystal SiC as a High Temperature Sensor https://doi.org/10.1557/proc-792-r5.3
Fiducial Mark and CTOA Estimates of Thin Film Adhesion https://doi.org/10.1023/a:1024983930481