Thin Film Adhesion by Nanoindentation-induced Superlayers. Final Report https://doi.org/10.2172/809372
Substrate Effects on Indentation Plastic Zone Development in Thin Soft Films https://doi.org/10.1557/jmr.2001.0434
Residual Stress and Microstructure of Electroplated Cu Film on Different Barrier Layers https://doi.org/10.1557/proc-695-l1.11.1
Effects of Interface Structure on Gold Film Adhesion
Nanoindentation of Silicate Low-K Dielectric Thin Films https://doi.org/10.1557/proc-716-b12.13
Crack Arrest Toughness Assessment Through Thin Film Fiducial Marks
Interfacial Toughness Measurements for Thin Films on Substrates https://doi.org/10.1016/s1359-6454(01)00354-8
Fiducial Mark and Nanocrack Zone Formation During Thin Film Delamination https://doi.org/10.1080/01418610208240449
Fracture Toughness, Adhesion and Mechanical Properties of Low-K Dielectric Thin Films Measured by Nanoindentation https://doi.org/10.1016/s0040-6090(03)00406-1
Experiments with In-situ Thin Film Phone Cord Delamination Propagation