Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In The Arena by TechArena by Allyson Klein
S2 · E55
Aug 12, 2024
19:07
Episode notes
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Keywords
ai
allyson klein
Lam Research
Chee Ping Lee