Ep 385: When Chips Delaminate

Ep 385: When Chips Delaminate

Professor Alex Volinsky by Professor Alex Volinsky
E385
Oct 14, 2026
07:01

Episode notes

Temperature, Moisture and Modemixity Effects on Copper Leadframe/EMC Interfacial Fracture Toughness

DOI: https://doi.org/10.1007/s10704-013-9907-3