Mechanical Properties and Fracture Toughness of Organosilicate Glass (OSG) Lowk Dielectric Thin Films for Microelectronic Application https://doi.org/10.1023/a:1024944316369
Effects of Diffusion on Interfacial Fracture of Goldchromium Hybrid Microcircuit Film https://doi.org/10.1023/a:1024979829573
Nanoindentation Techniques for Assessing Mechanical Reliability at Nanoscale https://doi.org/10.1016/s0167-9317(03)00341-1
Microelectronic Engineering
Nanoindentation Methods in Interfacial Fracture Testing, Chapter 13 in Comprehensive Structural Integrity
Irradiated Single Crystals for High Temperature Measurements in Space Applications https://doi.org/10.1557/proc-851-nn1.4
Sub-Critical Telephone Cord Delamination Propagation and Adhesion Measurements https://doi.org/10.1557/proc-854-u9.5
Microfluidics Applications of Telephone Cord Delamination Blisters https://doi.org/10.1557/proc-855-w3.16
Effects of Neartip Rotation on Prebuckle Crack Growth of Compressed Beams Bonded to a Rigid Substrate https://doi.org/10.1016/j.ijsolstr.2003.10.002
Nanoindentation of Au and Pt/Cu Thin Films at Elevated Temperatures https://doi.org/10.1557/jmr.2004.0331