A Brittle to Ductile Transition (BDT) in Adhered Thin Films https://doi.org/10.1557/proc-594-351
Indentation-induced Debonding of Ductile Films https://doi.org/10.1557/proc-586-255
The Role of Plasticity in Bimaterial Fracture with Ductile Interlayers https://doi.org/10.1007/s11661-000-1006-1
The Role of Geometry and Plasticity in Thin, Ductile Film Adhesion
Adhesion Quantification of Post-CMP Copper to Amorphous SiN Passivation by Nanoindentation https://doi.org/10.1557/proc-649-q6.1
Microstructure and Mechanical Properties of Electroplated Cu Thin Films https://doi.org/10.1557/proc-649-q5.3
Finite Element Analysis of the Precracked Line Scratch Test https://doi.org/10.1557/proc-657-ee5.9
Effects of Diffusion on Interfacial Fracture of Multilayer Hybrid Microcircuit Films, N.R. Moody, D. P. Adams
Mechanical Properties, Adhesion, and Fracture Toughness of Low-K Dielectric Thin Films for Microelectronic Applications
Fiducial Marks as Measures of Thin Film Crack Arrest Toughness https://doi.org/10.1016/s0013-7944(02)00003-6