Ep 385: When Chips Delaminate

Ep 385: When Chips Delaminate

Professor Alex Volinsky di Professor Alex Volinsky
E385
14 ott 2026
07:01

Note sull'episodio

Temperature, Moisture and Modemixity Effects on Copper Leadframe/EMC Interfacial Fracture Toughness

DOI: https://doi.org/10.1007/s10704-013-9907-3