Ep 385: When Chips Delaminate

Ep 385: When Chips Delaminate

Professor Alex Volinsky por Professor Alex Volinsky
E385
14 oct 2026
07:01

Notas del episodio

Temperature, Moisture and Modemixity Effects on Copper Leadframe/EMC Interfacial Fracture Toughness

DOI: https://doi.org/10.1007/s10704-013-9907-3