Advanced Packaging Innovations in the Semiconductor Industry with Chee Ping Lee of Lam Research
In The Arena by TechArena por Allyson Klein
Notas del episodio
In this podcast, learn about the challenges of silicon advancement, the importance of advanced packaging, and how Lam is driving breakthroughs to support the future of AI and chiplet ecosystems.
Palabras clave
aiallyson kleinLam ResearchChee Ping Lee