Faced with strict lithography sanctions, Huawei just stunned the semiconductor world at IEEE ISCAS 2026 by unveiling the "Tau Scaling Law" and its new LogicFolding chip architecture. We're diving into how they plan to achieve 1.4nm-class density by shrinking signal travel time instead of transistors. We also break down a massive new Stanford HAI study exposing how automated AI hiring platforms are creating algorithmic "black boxes" of systemic racial bias, locking job seekers out across entire industries.

In this episode, we cover:

• Inside chip chief He Tingbo's announcement of the Tau Scaling Law (nicknamed "Her's Law"). How the upcoming Fall 2026 Kirin phone chip utilizes LogicFolding to bypass ASML lithography limits.
• Analyzing the groundbreaking Stanford HAI study of 4 million job applications,  ...